Resources

Engineering a Stable Battery Housing Challenge During early module testing, a battery manufacturer observed localized housing deformation and edge-seal failures after repeated charge/discharge cycles. Post test inspections revealed subtle swelling and misalignment in the cell stack—but the root...

Battery formation is a pivotal stage in the manufacture of batteries, determining their performance and longevity. This process involves the initial electrochemical transformation of raw materials, shaping the battery's efficiency and stability. Through controlled charge and discharge cycles, the...

Real-Time Nip Pressure Profiling Misaligned bearings, uncoordinated hydraulic pressure, or imperfect rollers can lead to lost productivity in wasted run time, troubleshooting, and wasted material. Setting up machines quickly and accurately are paramount for production. Take the guesswork out of...

Background Having proper nip roll alignment is crucially important for high-volume printing press machines. Five minutes of run time on misaligned rolls can result in thousands of dollars in damaged product. Depending on the size and location of the nip, taking nip measurements can be difficult...

Background In high-throughput processing – such as in bottling and food packaging industries – there are several twists, turns and other impacts a product encounters on its way to completion. Quality control personnel take precautions to make sure their systems are running as smoothly as possible...

Wafer Polishing Pressure Measurement Wafer or Chemical Mechanical Polishing (CMP) requires that an even surface is achieved or subsequent manufacturing steps will be adversely affected, costing your company money. The I-Scan™ pressure mapping system provides instantaneous insight into the pressures...

Semiconductor Clamping Pressure Distribution Challenge Unknown clamping forces during computer chip and heat sink mounting or wafer probe testing can cause considerable product defects and quality issues. This can lead to lower yields and increased costs and product waste. Solution The I-Scan™ force...

Evaluate Brush-to-Wafer Contact Pressure Polyvinyl alcohol (PVA) brushes are used in the semiconductor process during the post-CMP cleaning stage. Different PVA brush designs can affect wafer cleaning efficiency. Ensuring proper brush-to-wafer contact pressure and contact area is crucial in...

Pressure Measurement Improves Packaging Design and Sealing Identifying defects in product packaging, as well as optimizing their manufacturing process, is essential for keeping products fresh, sanitary, and free of damage. The I-Scan™ pressure mapping system can be used to measure the effectiveness...