Industries

Achieve Optimal Occlusal Loading with T-Scan™ Research studies show that 54% of patients experience prosthetic complications 1. Although implant dentistry is the best option for most patients improper loading of these implants and crowns can lead to a number of prosthetic and surgical complications...

Wafer Polishing Pressure Measurement Wafer or Chemical Mechanical Polishing (CMP) requires that an even surface is achieved or subsequent manufacturing steps will be adversely affected, costing your company money. The I-Scan™ pressure mapping system provides instantaneous insight into the pressures...

Semiconductor Clamping Pressure Distribution Challenge Unknown clamping forces during computer chip and heat sink mounting or wafer probe testing can cause considerable product defects and quality issues. This can lead to lower yields and increased costs and product waste. Solution The I-Scan™ force...

Evaluate Brush-to-Wafer Contact Pressure Polyvinyl alcohol (PVA) brushes are used in the semiconductor process during the post-CMP cleaning stage. Different PVA brush designs can affect wafer cleaning efficiency. Ensuring proper brush-to-wafer contact pressure and contact area is crucial in...

Pressure Measurement Improves Packaging Design and Sealing Identifying defects in product packaging, as well as optimizing their manufacturing process, is essential for keeping products fresh, sanitary, and free of damage. The I-Scan™ pressure mapping system can be used to measure the effectiveness...