Door Seal Testing Sensor

Electronic Design recently published the second article in a four-part series highlighting Tekscan’s perspective on the accelerating adoption of tactile sensing technologies—covering pressure mapping, temperature mapping, and embedded force sensing. The piece explores how evolving market needs and technology advances are driving broader adoption across industries, positioning Tekscan at the forefront of this transformation.

While Tekscan’s technology has long been used in sectors such as automotive and manufacturing, the landscape is shifting as new industries embrace advanced surface sensing solutions. In particular, battery manufacturing is rapidly emerging as a high-growth application area, where understanding pressure and temperature dynamics is critical for safety, quality, and performance.

This momentum is being fueled by several factors: advances in materials and electronics, cost efficiencies from printed and scalable sensing technologies, and increased readiness to integrate sensing directly into production environments. Tekscan’s ability to capture simultaneous pressure and temperature data in hard-to-reach spaces—like battery packs, stacked assemblies, and other critical interfaces—gives engineers insight where conventional sensors fall short.

Tekscan and SEMI are collaborating to develop flexible, stretchable sensors to measure hand grip for tactical training.

For product and manufacturing engineers, full-field sensing provides high-resolution data for validating designs, tightening process control, and optimizing system performance—shifting tactile sensing from a diagnostic tool to an integral part of manufacturing operations.

Read the full article on Electronic Design here,and stay tuned for the remaining installments in this four-part series exploring the future of tactile sensing.