Whether you are designing a battery for a new automotive EV design, industrial or consumer electronics, or any innovative battery product in this rapidly accelerating space, you have the same engineering goals: Performance, Lifespan, and Safety. The charge and discharge cycles of lithium-ion...

Battery formation is a pivotal stage in the manufacture of batteries, determining their performance and longevity. This process involves the initial electrochemical transformation of raw materials, shaping the battery's efficiency and stability. Through controlled charge and discharge cycles, the...

Background Having proper nip roll alignment is crucially important for high-volume printing press machines. Five minutes of run time on misaligned rolls can result in thousands of dollars in damaged product. Depending on the size and location of the nip, taking nip measurements can be difficult...

Background Most electronic assembly processes are performed by high-precision robotic systems. These systems are tasked to properly move and insert delicate components onto a circuit board. As a result, the assembly robots must be checked frequently for changes in alignment that can occur with...

Background The food packaging industry must always maintain high standards for their packaging seals. These standards are to protect the consumer from tampering and/or receiving damaged product. Sealing bars are used to properly seal two parts of a package in a high temperature environment, and...

Background Ultrasonic welding machines are used to create uniform seals, which are vitally important for containing products like contact lenses. In the ultrasonic welding process, thermoplastics are bonded together through the use of heat and applied force. A damaged seal can result in leaky...

Wafer Polishing Pressure Measurement Wafer or Chemical Mechanical Polishing (CMP) requires that an even surface is achieved or subsequent manufacturing steps will be adversely affected, costing your company money. The I-Scan™ pressure mapping system provides instantaneous insight into the pressures...

Semiconductor Clamping Pressure Distribution Challenge Unknown clamping forces during computer chip and heat sink mounting or wafer probe testing can cause considerable product defects and quality issues. This can lead to lower yields and increased costs and product waste. Solution The I-Scan™ force...

Evaluate Brush-to-Wafer Contact Pressure Polyvinyl alcohol (PVA) brushes are used in the semiconductor process during the post-CMP cleaning stage. Different PVA brush designs can affect wafer cleaning efficiency. Ensuring proper brush-to-wafer contact pressure and contact area is crucial in...

Pressure Mapping For Magnetorheological Finishing Of Precision Optical Surfaces Challenge Conventional polishing typically involves abrasives and backing materials that result in minute cracks in the glass surface that translate into impairment of theoretical optical performance. Magnetorheological...