As the sensor landscape continues to evolve, tactile sensing is entering a new era defined by connectivity, data, and intelligent system design. In the fourth and final article in our recent series on Electronic Design, Tekscan explores how sensor connectivity and analytics will shape the next decade of innovation.

While much attention goes to the sensing element itself, the article highlights an important but often-overlooked factor: the connection between sensor and electronics. Small differences in connector design, material, or resistance can introduce significant variability, especially in flexible printed circuits and wearable or industrial environments. Choosing the right interconnect strategy early on ensures long-term reliability and data integrity.

Moving Beyond Measurement

The tactile sensors of tomorrow will do more than measure force or pressure—they’ll deliver actionable insight. Networked sensing platforms are emerging that can stream data wirelessly, analyze it locally, and feed machine learning models for predictive monitoring. Whether in a factory floor application or a medical device, tactile sensors are becoming intelligent nodes in a larger connected ecosystem.

F-Scan GO In-Shoe Sensor System

Integration and Scale

The article points to two parallel trends shaping the field: the rise of new manufacturing techniques—like additive and printed electronics—that enable novel sensor formats, and the scaling of mature, proven technologies for broader use. In both cases, the key to success lies in thoughtful integration across mechanical, electrical, and software domains.

Read the Full Series

To explore these themes in greater depth—including real-world design considerations and future predictions—check out the full series on Electronic Design.