Resources

Resources

Browse our library of pressure mapping and force measurement resources, including eBooks, Case Studies, On Demand Webinars, Whitepapers, and much more.

Displaying 1 - 8 of 8

Pressure Mapping for EV Design Design differences and challenges for the next generation of EVs can be quite different than existing design for internal combustion vehicles. In addition to the core battery stack assembly and design, pressure mapping system analysis is key to many different aspects...

eBook

Tekscan's Pressure Mapping technology can measure interface pressure to increase reliability & yields. Free eBook outlines insights gained from pressure mapping in various applications related to the semiconductor industry.

Battery formation is a pivotal stage in the manufacture of batteries, determining their performance and longevity. This process involves the initial electrochemical transformation of raw materials, shaping the battery's efficiency and stability. Through controlled charge and discharge cycles, the...

Wafer Polishing Pressure Measurement Wafer or Chemical Mechanical Polishing (CMP) requires that an even surface is achieved or subsequent manufacturing steps will be adversely affected, costing your company money. The I-Scan™ pressure mapping system provides instantaneous insight into the pressures...

Semiconductor Clamping Pressure Distribution Challenge Unknown clamping forces during computer chip and heat sink mounting or wafer probe testing can cause considerable product defects and quality issues. This can lead to lower yields and increased costs and product waste. Solution The I-Scan™ force...

Evaluate Brush-to-Wafer Contact Pressure Polyvinyl alcohol (PVA) brushes are used in the semiconductor process during the post-CMP cleaning stage. Different PVA brush designs can affect wafer cleaning efficiency. Ensuring proper brush-to-wafer contact pressure and contact area is crucial in...

Pressure Mapping For Magnetorheological Finishing Of Precision Optical Surfaces Challenge Conventional polishing typically involves abrasives and backing materials that result in minute cracks in the glass surface that translate into impairment of theoretical optical performance. Magnetorheological...

Evaluate Heat Sink Contact Pressure Background High density, active, electronics emit energy that can raise their temperature leading to failures. Heat sinks are secured to components to dissipate their heat. Challenge For the heat sink to function properly, even contact must be achieved between the...