Resources

Background Ultrasonic welding machines are used to create uniform seals, which are vitally important for containing products like contact lenses. In the ultrasonic welding process, thermoplastics are bonded together through the use of heat and applied force. A damaged seal can result in leaky...

Wafer Polishing Pressure Measurement Wafer or Chemical Mechanical Polishing (CMP) requires that an even surface is achieved or subsequent manufacturing steps will be adversely affected, costing your company money. The I-Scan™ pressure mapping system provides instantaneous insight into the pressures...

Semiconductor Clamping Pressure Distribution Challenge Unknown clamping forces during computer chip and heat sink mounting or wafer probe testing can cause considerable product defects and quality issues. This can lead to lower yields and increased costs and product waste. Solution The I-Scan™ force...

Evaluate Brush-to-Wafer Contact Pressure Polyvinyl alcohol (PVA) brushes are used in the semiconductor process during the post-CMP cleaning stage. Different PVA brush designs can affect wafer cleaning efficiency. Ensuring proper brush-to-wafer contact pressure and contact area is crucial in...

Pressure Measurement Improves Packaging Machine Sealing Jaws Performance Challenge A poor quality seal produced by a packaging machine can result in large quantities of product waste for a manufacturer. This can be a result of uneven bars, low forces or worn parts in the clamp sealing assembly...

Evaluate Heat Sink Contact Pressure Background High density, active, electronics emit energy that can raise their temperature leading to failures. Heat sinks are secured to components to dissipate their heat. Challenge For the heat sink to function properly, even contact must be achieved between the...