Resources

Resources

Browse our library of pressure mapping and force measurement resources, including eBooks, Case Studies, On Demand Webinars, Whitepapers, and much more.

Displaying 1 - 7 of 7

Automotive Door Seal Pressure Wind, noise, and water leaks in a new vehicle can be a significant source of customer dissatisfaction, create a perception of poor quality, and cause warranty expenses. Proper adjustment of hinges and door latches while the car is in the factory and the doors are being...

Pressure Mapping for EV Design Design differences and challenges for the next generation of EVs can be quite different than existing design for internal combustion vehicles. In addition to the core battery stack assembly and design, pressure mapping system analysis is key to many different aspects...

Pressure measurement is vital for gasket design because it ensures seal integrity, helps select the right material, verifies performance, maintains safety, and optimizes the design. Some common gasket materials used in pressure-sensitive applications: Rubber: Ideal for low-pressure applications and...

Wafer Polishing Pressure Measurement Wafer or Chemical Mechanical Polishing (CMP) requires that an even surface is achieved or subsequent manufacturing steps will be adversely affected, costing your company money. The I-Scan™ pressure mapping system provides instantaneous insight into the pressures...

Semiconductor Clamping Pressure Distribution Challenge Unknown clamping forces during computer chip and heat sink mounting or wafer probe testing can cause considerable product defects and quality issues. This can lead to lower yields and increased costs and product waste. Solution The I-Scan™ force...

Evaluate Brush-to-Wafer Contact Pressure Polyvinyl alcohol (PVA) brushes are used in the semiconductor process during the post-CMP cleaning stage. Different PVA brush designs can affect wafer cleaning efficiency. Ensuring proper brush-to-wafer contact pressure and contact area is crucial in...

Evaluate Heat Sink Contact Pressure Background High density, active, electronics emit energy that can raise their temperature leading to failures. Heat sinks are secured to components to dissipate their heat. Challenge For the heat sink to function properly, even contact must be achieved between the...