Thermal Mapping
Tekscan’s Temperature Mapping Solution addresses a crucial need in the industrial sensor market by offering a new level of thermal insight that enhances design, process control, and quality assurance. This innovative solution provides dynamic, high-resolution thermal data, making it invaluable for applications such as monitoring thermal behavior in battery formation lines, optimizing heat dissipation in electronics, and validating sealing temperatures in packaging.
Whether dealing with enclosed machinery, rotating equipment, or multi-layer assemblies, Tekscan’s temperature sensing system delivers real-time insights into thermal behavior that can't be captured with thermal cameras and would be very difficult to collect with multiple thermocouples. It collects real time data from up to 192 temperature sensing points in a single sensor array. This ultra-thin thermoresistive sensor is the solution when visual, thermal film, infrared, thermoelectrical or other point-based temperature sensors are impossible, impractical, or inaccurate.
Key applications include:
- Benchmarking the efficiency of potential thermal insulators or thermal interface material spreading
- Collecting data to model potential temperature failure modes in component assembly
- Understanding heat dissipation across surfaces to set requirements for thermal protection
- Correlate both temperature and pressure change data over time in battery fixtures during charge cycling
Temperature Sensor Software over Time Graph