Semiconductor Precision Clamping Pressure

Determine proper clamping pressure during computer chip or heat sink mounting.

Semiconductor Clamping Pressure Distribution

Unknown clamping forces during computer chip and heat sink mounting or wafer probe testing can cause considerable product defects and quality issues. This can lead to lower yields and increased costs and product waste. The I-Scan^®force and pressure measurement system is a key diagnostic and machine set-up tool for clamping fixtures. The I-Scan's ultra-thin (0.1 mm) sensors can be placed between any two mating surfaces, such as a heat sink and its heat source or a probe and wafer. The system allows for real-time viewing of the pressure distribution between the clamping fixture and opposing surface.

If the optimal pressure is not achieved, adjustments can be made to optimize the clamping fixture design, quantify forces, or determine ideal protocols such as torque patterns and procedures. The I-Scan can be used to optimize pressure distribution prior to a testing sequence or production run, saving valuable company time and money. With the help of Tekscan's highly qualified sales and engineering support team, each system can be configured to meet your specific needs.

pressure distribution during chip mounting

Progressive iterations of tooling, process, and/or fixturing adjustments yield more even pressure distribution across the area of interest

Semiconductor Clamp Pressure distribution Applications

Coplanarization
Research and Development
Detect defects or obstructions
Before and after adjustment comparison
Quality assurance testing
Machine to machine comparison
Design verification testing

Benefits of Pressure Mapping

Better bonds and seals
Identify low yield machines
Increase manufacturing yields
Reduce costs and product waste
Provides data for improved design
Less wear and tear on production equipment
System Flexibility- can adapt to different or changing measurement needs

Typical Pressure Sensors used for Semiconductor Clamping

Sensor Model 5026

Sensing Area Total

Width Height Sensels Sensel Density

2.60 in. 2.20 in. 9,152 1600.0 in.²

66.0 mm 55.9 mm 9,152 248.0 cm²
Sensor Model 5027

Sensing Area Total

Width Height Sensels Sensel Density

1.10 in. 1.10 in. 1,936 1600.0 in.²

27.9 mm 27.9 mm 1,936 248.0 cm²
Sensor Model 5051

Sensing Area Total

Width Height Sensels Sensel Density

2.20 in. 2.20 in. 1,936 400.0 in.²

55.9 mm 55.9 mm 1,936 62.0 cm²
Sensor Model 7501

Sensing Area Total

Width Height Sensels Sensel Density

3.94 in. 3.47 in. 8,800 644.2 in.²

100.1 mm 88.1 mm 8,800 99.9 cm²