High density, active, electronics emit energy that can raise their temperature leading to
failures. Heat sinks are secured to components to dissipate their heat. For the heat sink to
function properly, even contact must be achieved between the part being cooled and the heat
source. This can be difficult to achieve due to the mechanically “stiff” nature of the heat sink
and hard surfaces involved; where contact may be achieved well at one or two points, but
larger regions of potential contact have gaps.
The I-Scan’s patented, paper-thin sensors can
easily be inserted between these two mating surfaces to evaluate and improve the contact. With
the help of Tekscan’s highly qualified sales and engineering support team, each system may be
configured to meet your specific needs.
Above: 2D pressure display of a heat sink. Higher pressures are evident along
the right corner, indicating that the contact area between the heat sink and heat
source is not uniform.
Applications
Design verification testing
Reliability improvements
R&D for new designs
Benefits
Improve design
Minimize validation testing time
Reduce failures
Typical sensors used in this application
Visit our Sensor Catalog to browse our sensors.
Above: 2D pressure display of a heat sink. Higher pressures are evident along
the right corner, indicating that the contact area between the heat sink and heat
source is not uniform.