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Chemical Mechanical Polishing (CMP) |
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Chemical mechanical polishing requires that an even surface is achieved or subsequent
manufacturing steps will be adversely affected costing your company money! The I-Scan
system provides instantaneous insight into the pressures applied by a polishing head on
a wafer during the polishing process. If uneven pressures exist, the I-Scan will display
them in colorful 2-D and 3-D images. Machine adjustments can then be made and new
measurements taken to ensure even pressure. The patented thin sensors, easily fit in this
application and minimize environmental disturbance thus measuring the true pressure
pattern. Sensors are available in different shapes, are reusable, and provide accurate
pressure readings. With the help of our highly qualified sales and engineering support
team, each system may be configured to meet your specific needs.
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Non-uniform material removed is likely due to an uneven pressure on the wafer from
the polishing head - higher pressures applied on the two lobes of the polishing head |
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Applications
- Identify uneven polish, worn parts, and low pressures
- Before and after adjustment comparison
- Machine to machine comparison
- Reliability and validation testing
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Benefits
- Improves machine set-up:
- Save time & money
- Minimize product waste
- Identify low yield machines
- Increase manufacturing yield
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Typical sensors used in this application
Visit our Sensor Catalog to browse our sensors. |
Model #
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Sensing Area
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Spatial Density
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5250
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9.68 x 9.68 in (245.9 x 245.9 mm)
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20.7/ in2 (3.2/cm2)
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5315
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19.20 x 16.80 in (487.7 x 426.7 mm)
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6.3/in2 (1.0/cm2)
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6010N
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14.2 x 14.2 in (361 x 361 mm)
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38/in2 (5.9/cm2)
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7101
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19.2 x 17.6 in (487.7 x 447 mm)
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25/in2 (3.9/cm2)
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To Request More Information or a Demonstration- click here
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I-Scan System
